GA Series silicone-free thermal conductive grease is designed for applications requiring low thermal resistance in very thin gaps. The single-component, non-curing grease provides excellent application workability and can be dispensed directly onto substrates. Its silicone-free formulation makes it suitable for thermal management applications where low-molecular cyclic siloxane is a concern.
GA Series Silicone-Free Thermal Conductive Grease — Key Features
Silicone-Free Formulation
GA Series does not use silicone oil, helping avoid issues associated with low-molecular cyclic siloxane such as contact failures.
Single-Component Grease
The single-component formulation provides convenient handling and application without the need to mix multiple components before use.
Non-Curing Material
GA Series is a non-curing thermal conductive grease, making it suitable for applications where a non-curing thermal interface material is required.
Very Thin Gap Application
The grease can be applied in very thin gaps, helping achieve low thermal resistance between heat-generating components and heat dissipation structures.
Excellent Application Workability
GA Series offers excellent handling properties and can be easily dispensed and applied onto substrates.
Low Thermal Resistance
The thin-layer application of GA Series helps achieve low thermal resistance for demanding thermal management applications.
GA Series Grades & Technical Data
GA Series is available in four grades with thermal conductivity ranging from 2.0 to 4.5 W/m-K. Each grade provides different material characteristics, allowing selection according to thermal conductivity, film thickness and application requirements.
| Grade | Thermal Conductivity |
|---|---|
| GA200 | 2.0 W/m-K |
| GA204 | 2.4 W/m-K |
| GA401 | 4.1 W/m-K |
| GA690 | 4.5 W/m-K |
Thermal conductivity values are based on the heat-line method. Please contact us for detailed technical data and product selection support.
GA Series Technical Characteristics
| Characteristic | GA200 | GA204 | GA401 | GA690 |
|---|---|---|---|---|
| Thermal Conductivity | 2.0 W/m-K | 2.4 W/m-K | 4.1 W/m-K | 4.5 W/m-K |
| Appearance | White | White | Gray | Gray |
| Binder | Ester oil | Ester oil | Ester oil | Ester oil |
| Viscosity | 170 Pa·s | 110 Pa·s | 350 Pa·s | 300 Pa·s |
| Specific Gravity | 3.1 | 3.2 | 2.55 | 2.55 |
| Minimum Film Thickness | 20 μm | 20 μm | 25 μm | 25 μm |
| Operating Temperature Range | -40 to 150°C | -40 to 150°C | -40 to 150°C | -40 to 150°C |
Applications
GA Series can be considered for thermal management applications where thin-gap coverage, low thermal resistance and easy application are important. Its silicone-free formulation makes it suitable for applications where low-molecular cyclic siloxane is a concern.
Electronics & Semiconductor
GA Series can support thermal management in electronic and semiconductor applications requiring low thermal resistance and a thin thermal interface layer.
Next Generation Communications
GA Series is suitable for thermal management applications in next-generation communication equipment where thin-gap thermal interfaces and reliable heat dissipation are required.
Power Electronics
GA Series can be considered for heat-generating electronic components where low thermal resistance and easy dispensing are important requirements.
Industrial Equipment
The non-curing grease provides a practical thermal interface option for industrial equipment requiring efficient heat dissipation and thin-layer application.
Why Choose GA Series?
GA Series combines silicone-free formulation, thin-gap application and excellent handling properties to provide a practical thermal interface solution for applications requiring low thermal resistance.
Silicone-Free Solution
GA Series does not use silicone oil and is designed to avoid issues associated with low-molecular cyclic siloxane.
Thin-Layer Thermal Interface
The material can be compressed into a very thin layer, helping achieve low thermal resistance between mating surfaces.
Easy Application
The grease provides excellent application workability and can be dispensed directly onto substrates for convenient processing.
Looking for the Right GA Series Grade?
Selecting the right thermal conductive grease depends on factors such as required thermal conductivity, interface thickness, operating temperature, application method and component design. Our team can help you identify a suitable GA Series grade based on your specific thermal management requirements.
Please contact us for technical support, product selection and detailed application information.
You can also explore our Thermal Management & Advanced Materials solutions for other thermal interface materials.
For additional product information, please refer to the official GA Series information.