MANION™ High Thermal Conductive Sheet is a high-performance thermal interface material designed to provide efficient heat dissipation for demanding applications. By using magnetic field alignment technology, MANION™ can orient carbon fibers in the thickness direction to achieve high thermal conductivity while maintaining flexibility.
MANION High Thermal Conductive Sheet — Key Features
High Thermal Conductivity
MANION™ offers high thermal conductivity for efficient heat dissipation in demanding thermal management applications.
Magnetic Field Alignment
Magnetic field alignment technology orients carbon fibers in the thickness direction to enhance thermal conductivity.
Flexible Sheet Structure
The flexible sheet structure provides conformability and helps accommodate differences in thermal expansion.
Thickness-Direction Heat Dissipation
Carbon fiber alignment in the thickness direction supports efficient heat transfer from heat-generating components.
Stress Relief
The flexible material helps relieve stress caused by differences in thermal expansion between mating components.
Low Molecular Cyclic Siloxane
Low molecular cyclic siloxane is controlled to support demanding electronic and thermal management applications.
MANION™ Series Grades & Technical Data
MANION™ Series is available in multiple grades with different thermal conductivity levels to meet various thermal management requirements. The product lineup includes grades with thermal conductivity ranging from 6 to 45 W/m-K, allowing selection according to application, heat dissipation requirements and component design.
MANION™ High Thermal Conductive Sheet is available in multiple grades with different thermal conductivity levels to meet various thermal management requirements. This range of MANION high thermal conductive sheet grades allows selection according to heat dissipation requirements, component design and application conditions.
| Grade | Thermal Conductivity |
|---|---|
| MANION35(E20) | 16 W/m-K |
| MANION50α | 17 W/m-K |
| MANION-D5 | 25 W/m-K |
| MANION-SCV | 30 W/m-K |
| MANION-FR | 35 W/m-K |
| MANION-ST | 25 W/m-K |
| MANION-HST | 25 W/m-K |
| MANION-HSTZ | 45 W/m-K |
| PT-UT | 6 W/m-K |
| PT-12V | 12 W/m-K |
Thermal conductivity values are provided for product grade comparison. Please contact us for detailed technical data, specifications and product selection support.’
MANION™ can be selected according to the thermal performance required for each application. Different grades provide different thermal conductivity levels, allowing engineers to consider heat generation, component structure and thermal interface requirements when selecting a suitable material. The flexible sheet format also supports applications where conformability and stress management are important considerations.
Applications
MANION™ can be considered for thermal interface applications where efficient heat dissipation, flexibility and high thermal conductivity are required. Its range of grades supports different thermal management requirements across electronics, automotive, power electronics and industrial equipment.
Electronics & Semiconductor
MANION™ provides high thermal conductivity for thermal management applications in electronic and semiconductor devices. Its flexible sheet structure can support thermal contact between heat-generating components and heat dissipation structures.
Automotive & Mobility
MANION™ can be used for thermal management in automotive and mobility applications where efficient heat dissipation and flexible thermal interface materials are required.
Power Electronics
High thermal conductivity grades of MANION™ can support heat dissipation from power electronic components and other heat-generating devices requiring effective thermal interfaces.
Industrial Equipment
MANION™ provides flexible thermal interface options for industrial equipment and manufacturing applications where reliable heat dissipation and thermal management performance are required.
Why Choose MANION™?
MANION™ combines high thermal conductivity with a flexible sheet structure, providing high-performance thermal interface options for demanding applications. MANION high thermal conductive sheet grades are available for different thermal management requirements and component designs.
High Thermal Performance
MANION™ offers thermal conductivity grades from 6 to 45 W/m-K, providing options for applications with different heat dissipation requirements.
Flexible Material
The flexible sheet structure helps the material conform to mating surfaces and accommodate stress caused by differences in thermal expansion.
Multiple Conductivity Grades
A wide range of MANION™ grades allows engineers to select a suitable thermal conductivity level according to application requirements and component design.
Looking for the Right MANION™ Grade?
Choosing the right thermal interface material depends on factors such as required thermal conductivity, interface thickness, component design, operating conditions and application requirements. Our team can help you identify a suitable MANION™ grade based on your specific thermal management needs.
Please contact us for technical support, product selection and detailed application information.
For additional product information, please refer to the official MANION™ Series information.
You can also explore our Thermal Management & Advanced Materials solutions for other thermal interface materials.